Brazed wick for a heat transfer device

ABSTRACT

A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets, provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device.

This application is a continuation application of U.S. application Ser.No. 10/607,337, and filed on Jun. 26, 2003 now U.S. Pat. No. 6,994,152.

FIELD OF THE INVENTION

The present invention generally relates to heat transfer devices thatrely upon capillary action as a transport mechanism and, moreparticularly, to wicking materials for such devices.

BACKGROUND OF THE INVENTION

It has been suggested that a computer is a thermodynamic engine thatsucks entropy out of data, turns that entropy into heat, and dumps theheat into the environment. The ability of prior art thermal managementtechnology to get that waste heat out of semiconductor circuits and intothe environment, at a reasonable cost, limits the density and clockspeed of electronic systems.

A typical characteristic of heat transfer devices for electronic systemsis that the atmosphere is the final heat sink of choice. Air coolinggives manufacturers access to the broadest market of applications.Another typical characteristic of heat transfer devices for electronicstoday is that the semiconductor chip thermally contacts a passivespreader or active thermal transport device, which conducts the heatfrom the chip to one of several types of fins. These fins convect heatto the atmosphere with natural or forced convection.

As the power to be dissipated from semiconductor devices increases withtime, a problem arises: over time the thermal conductivity of theavailable materials becomes too low to conduct the heat from thesemiconductor device to the fins with an acceptably low temperaturedrop. The thermal power density emerging from the semiconductor deviceswill be so high that copper, silver, or even gold based spreadertechnology will not be adequate.

One technology that has proven beneficial to this effort is the heatpipe. A heat pipe includes a sealed envelope that defines an internalchamber containing a capillary wick and a working fluid capable ofhaving both a liquid phase and a vapor phase within a desired range ofoperating temperatures. When one portion of the chamber is exposed torelatively high temperature it functions as an evaporator section. Theworking fluid is vaporized in the evaporator section causing a slightpressure increase forcing the vapor to a relatively lower temperaturesection of the chamber, which functions as a condenser section. Thevapor is condensed in the condenser section and returns through thecapillary wick to the evaporator section by capillary pumping action.Because a heat pipe operates on the principle of phase changes ratherthan on the principles of conduction or convection, a heat pipe istheoretically capable of transferring heat at a much higher rate thanconventional heat transfer systems. Consequently, heat pipes have beenutilized to cool various types of high heat-producing apparatus, such aselectronic equipment (See, e.g., U.S. Pat. Nos. 3,613,778; 4,046,190;4,058,299; 4,109,709; 4,116,266; 4,118,756; 4,186,796; 4,231,423;4,274,479; 4,366,526; 4,503,483; 4,697,205; 4,777,561; 4,880,052;4,912,548; 4,921,041; 4,931,905; 4,982,274; 5,219,020; 5,253,702;5,268,812; 5,283,729; 5,331,510; 5,333,470; 5,349,237; 5,409,055;5,880,524; 5,884,693; 5,890,371; 6,055,297; 6,076,595; and 6,148,906).

The flow of the vapor and the capillary flow of liquid within the systemare both produced by pressure gradients that are created by theinteraction between naturally-occurring pressure differentials withinthe heat pipe. These pressure gradients eliminate the need for externalpumping of the system liquid. In addition, the existence of liquid andvapor in equilibrium, under vacuum conditions, results in higher thermalefficiencies. In order to increase the efficiency of heat pipes, variouswicking structures have been developed in the prior art to promoteliquid transfer between the condenser and evaporator sections as well asto enhance the thermal transfer performance between the wick and itssurroundings. They have included longitudinally disposed parallelgrooves and the random scoring of the internal pipe surface. Inaddition, the prior art also discloses the use of a wick structure whichis fixedly attached to the internal pipe wall. The compositions andgeometries of these wicks have included, a uniform fine wire mesh andsintered metals. Sintered metal wicks generally comprise a mixture ofmetal particles that have been heated to a temperature sufficient tocause fusing or welding of adjacent particles at their respective pointsof contact. The sintered metal powder then forms a porous structure withcapillary characteristics. Although sintered wicks have demonstratedadequate heat transfer characteristics in the prior art, the minutemetal-to-metal fused interfaces between particles tend to constrictthermal energy conduction through the wick. This has limited theusefulness of sintered wicks in the art.

Prior art devices, while adequate for their intended purpose, sufferfrom the common deficiency, in that they do not fully realize theoptimum inherent heat transfer potential available from a given heatpipe. To date, no one has devised a wick structure for a heat pipe,which is sufficiently simple to produce, and yet provides optimum heattransfer characteristics for the heat pipe in which it is utilized.

SUMMARY OF THE INVENTION

The present invention provides a capillary structure for a heat transferdevice that comprises a plurality of particles joined together by abrazing compound such that fillets of the brazing compound are formedbetween adjacent ones of the plurality of particles. In this way, anetwork of capillary passageways are formed between the particles to aidin the transfer of working fluid by capillary action, while theplurality of fillets provide enhanced thermal conduction propertiesbetween the plurality of particles so as to greatly improve over allheat transfer efficiency of the device.

In one embodiment, a heat pipe is provided that includes a hermeticallysealed and partially evacuated enclosure, where the enclosure hasinternal surfaces and is at least partially drenched with a two-phasevaporizable fluid. A wick is disposed on at least one of the internalsurfaces of the enclosure. The wick advantageously comprises a pluralityof particles joined together by a brazing compound such that fillets ofthe brazing compound are formed between adjacent ones of the pluralityof particles so as to form a network of capillary passageways betweenthe particles.

In a further embodiment of the present invention, a heat pipe isprovided comprising a sealed and partially evacuated enclosure having aninternal surface and a working fluid disposed within a portion of theenclosure. A grooved brazed wick is disposed upon the internal surfaceof the heat pipe. The grooved brazed wick comprises a plurality ofindividual particles which together yield an average particle diameterand a brazing compound such that fillets of the brazing compound areformed between adjacent ones of the plurality of particles. At least twolands are provided that are in fluid communication with one anotherthrough a particle layer disposed between the at least two lands whereinthe particle layer comprises at least one dimension that is no more thanabout six average particle diameters wherein the particles in theparticle layer are thermally engaged with one another by a plurality ofthe fillets.

A method is also provided for making a heat pipe wick on an insidesurface of a heat pipe container comprising the steps of providing aslurry of metal particles that are mixed with a brazing compound. Themetal particles have a first melting temperature and the brazingcompound has a second melting temperature that is lower than the firstmelting temperature. At least a portion of the inside surface of thecontainer is coated with the slurry, and dried to form a green wick. Thegreen wick is then heated to a temperature that is no less than thesecond melting temperature and below the first melting temperature sothat the brazing compound is drawn by capillary action toward adjacentones of the metal particles so as to form heat-distribution filletsbetween the adjacent metal particles thereby to yield a brazed wick.

In an alternative embodiment of the method of the invention, a mandrelhaving a grooved contour and a plurality of recesses is positionedwithin a portion of a heat pipe container. A slurry of metal particleshaving an average particle diameter and that are mixed with a brazingcompound is introduced into the container. The metal particles comprisea first melting temperature and the brazing compound comprises a secondmelting temperature that is lower than the first melting temperature. Atleast a portion of the inside surface of the container is coated withthe slurry so that the slurry conforms to the grooved contour of themandrel and forms a layer of slurry between adjacent grooves thatcomprises no more than about six average particle diameters. The slurryis then dried to form a green wick. The green wick is then heated to atemperature that is no less than the second melting temperature andbelow the first melting temperature so that the brazing compound isdrawn by capillary action toward adjacent ones of the metal particles soas to form heat-distribution fillets between the adjacent metalparticles thereby to yield a brazed wick.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages of the present invention will bemore fully disclosed in, or rendered obvious by, the following detaileddescription of the preferred embodiments of the invention, which are tobe considered together with the accompanying drawings wherein likenumbers refer to like parts and further wherein:

FIG. 1 is an exploded perspective view of a typical heat pipe enclosureof the type used in connection with the present invention;

FIG. 2 is a perspective view of the heat pipe enclosure shown in FIG. 1;

FIG. 3 is a cross-sectional view of the heat pipe shown in FIG. 2;

FIG. 4 is a significantly enlarged cross-sectional view of a portion ofa brazed wick formed in accordance with one embodiment of the presentinvention;

FIG. 5 is a broken-way perspective view that has been highly enlarged toclearly represent metal particles and fillets that comprise oneembodiment of the present invention;

FIG. 6 is a highly enlarged view, similar to FIG. 5, of an alternativeembodiment of brazed wick formed in accordance with the presentinvention;

FIG. 7 is an exploded perspective view of a heat pipe enclosure havingan alternative embodiment of brazed wick in accordance with the presentinvention;

FIG. 8 is a cross-sectional view, as taken along lines 8—8 in FIG. 7;

FIG. 9 is a further alternative embodiment of heat pipe enclosure formedin accordance with the present invention;

FIG. 10 is a cross-sectional view of the tubular heat pipe enclosureshown in FIG. 9, as taken along lines 10—10 in FIG. 9;

FIG. 11 is a highly enlarged view of a portion of a brazed wick disposedon the wall of the heat pipe shown in FIG. 10;

FIG. 12 is a perspective cross-sectional view of a tower heat pipehaving a brazed wick formed in accordance with the present invention;

FIG. 13 is a highly enlarged surface view of a brazed wick coating theanterior surfaces of the tower heat pipe shown in FIG. 12;

FIG. 14 is an alternative embodiment of tower heat pipe having groovedbase wick formed in accordance with the present invention;

FIG. 15 is a highly enlarged surface view of a brazed wick formed inaccordance with the present invention;

FIG. 16 is a broken-way cross-sectional view of the groove-wick shown inFIGS. 7, 8, and 13;

FIG. 17 is a highly enlarged cross-sectional view of a portion of thegroove brazed wick shown in FIGS. 7, 8, 13, and 15; and

FIG. 18 is an end view of a mandrel used in manufacturing a groovedbrazed wick in accordance with the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

This description of preferred embodiments is intended to be read inconnection with the accompanying drawings, which are to be consideredpart of the entire written description of this invention. The drawingfigures are not necessarily to scale and certain features of theinvention may be shown exaggerated in scale or in somewhat schematicform in the interest of clarity and conciseness. In the description,relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and“bottom” as well as derivatives thereof (e.g., “horizontally,”“downwardly,” “upwardly,” etc.) should be construed to refer to theorientation as then described or as shown in the drawing figure underdiscussion. These relative terms are for convenience of description andnormally are not intended to require a particular orientation. Termsincluding “inwardly” versus “outwardly,” “longitudinal” versus “lateral”and the like are to be interpreted relative to one another or relativeto an axis of elongation, or an axis or center of rotation, asappropriate. Terms concerning attachments, coupling and the like, suchas “connected” and “interconnected,” refer to a relationship whereinstructures are secured or attached to one another either directly orindirectly through intervening structures, as well as both movable orrigid attachments or relationships, unless expressly describedotherwise. The term “operatively connected” is such an attachment,coupling or connection that allows the pertinent structures to operateas intended by virtue of that relationship. In the claims,means-plus-function clauses are intended to cover the structuresdescribed, suggested, or rendered obvious by the written description ordrawings for performing the recited function, including not onlystructural equivalents but also equivalent structures.

Referring to FIGS. 1–6, the present invention comprises a wick structurefor a heat pipe or heat spreader 2, hereinafter referred to as simply aheat pipe. Such heat pipes 2 are often sized and shaped to transferand/or spread the thermal energy generated by at least one thermalenergy source, e.g., a semiconductor device (not shown), that isthermally engaged between a portion of the heat pipe and a heat sink(not shown). Heat pipes 2 generally comprise a hermetically sealedenclosure such as a flat, hollow plate-like structure (FIG. 2) or atubular structure (FIGS. 9, 12 and 14). Regardless of outer profile,each enclosure structure defines an evaporator section 5, a condensersection 7, and an internal void space or vapor chamber 10. For example,in a planar rectangular heat pipe 2, vapor chamber 10 is defined betweena bottom wall 12 and a top wall 14. In a tubular or tower heat pipe 2,vapor chamber 10 extends longitudinally from one end of the tube to theother (FIGS. 9, 12, and 14).

In one preferred embodiment of a rectilinear enclosure, bottom wall 12and a top wall 14 comprise substantially uniform thickness sheets of athermally conductive material, e.g., copper, steel, aluminum, or any oftheir respective alloys, and are spaced-apart by about 2.0 (mm) to about4.0 (mm) so as to form vapor chamber 10 within heat pipe 2. Top wall 14of heat pipe 2 is often substantially planar, and is complementary inshape to bottom wall 12. Bottom wall 12 preferably comprises asubstantially planer inner surface 18 and a peripheral edge wall 20.Peripheral edge wall 20 projects outwardly from the peripheral edge ofinner surface 18 so as to circumscribe inner surface 18. Vapor chamber10 is created within heat pipe 2 by the attachment of bottom wall 12 anda top wall 14, along their common edges which are then hermeticallysealed at their joining interface 24. A vaporizable fluid (e.g., water,ammonia or freon not shown) resides within vapor chamber 10, and servesas the working fluid for heat pipe 2. For example, heat pipe 2 may bemade of copper or copper silicon carbide with water, ammonia, or freongenerally chosen as the working fluid. Heat pipe 2 is completed bydrawing a partial vacuum within the vapor chamber after injecting theworking fluid just prior to final hermetic sealing of the common edgesof bottom wall 12 and the top wall 14.

Referring to FIGS. 3–6, in order for heat pipe operation to be initiatedwithin the enclosure of heat pipe 2, a capillary must be present withinvapor chamber 10 that will pump condensed liquid from condenser section7 back to evaporator sections, substantially unaided by gravity. In thepresent invention, a brazed wick 25 is located on inner surface 18 whichdefines the boundaries of vapor chamber 10. Brazed wick 25 comprises aplurality of metal particles 27 combined with a filler metal orcombination of metals that is often referred to as a “braze” or brazingcompound 30. It will be understood that “brazing” is the joining ofmetals through the use of heat and a filler metal, i.e., brazingcompound 30. Brazing compound 30 very often comprises a meltingtemperature that is above 450° C.–1000° C. but below the melting pointof metal particles 27 that are being joined to form brazed wick 25.

In general, to form brazed wick 25 according to the present invention, aplurality of metal particles 27 and brazing compound 30 are heatedtogether to a brazing temperature that melts brazing compound 30, butdoes not melt plurality of metal particles 27. Significantly, duringbrazing metal particles 27 are not fused together as with sintering, butinstead are joined together by creating a metallurgical bond betweenbrazing compound 30 and the surfaces of adjacent metal particles 27through the creation of fillets of re-solidified brazing compound(identified by reference numeral 33 in FIGS. 5 and 6). Advantageously,the principle by which brazing compound 30 is drawn through the porousmixture of metal particles 27 to create fillets 33 is “capillaryaction”, i.e., the movement of a liquid within the spaces of a porousmaterial due to the inherent attraction of molecules to each other on aliquid's surface. Thus, as brazing compound 30 liquefies, the moleculesof molten brazing metals attract one another as the surface tensionbetween the molten braze and the surfaces of individual metal particles27 tend to draw the molten braze toward each location where adjacentmetal particles 27 are in contact with one another. Fillets 33 areformed at each such location as the molten braze metals re-solidify.

In the present invention, brazing compound 30 and fillets 33 create ahigher thermal conductivity wick than, e.g., sintering or fusingtechniques. This higher thermal conductivity wick directly improves thethermal conductance of the heat transfer device in which it is formed,e.g., heat pipe, loop heat pipe, etc. Depending upon the regime of heatflux that evaporator 5 is subjected to, the conductance of brazed wick25 has been found to increase between directly proportional to and thesquare root of the thermal conductivity increase. Importantly, materialcomponents of brazing compound 30 must be selected so as not tointroduce chemical incompatibility into the materials system comprisingheat pipe 2.

Metal particles 27 may be selected from any of the materials having highthermal conductivity, that are suitable for fabrication into brazedporous structures, e.g., carbon, tungsten, copper, aluminum, magnesium,nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, andmay comprise either substantially spherical, oblate or prolatespheroids, ellipsoid, or less preferably, arbitrary or regularpolygonal, or filament-shaped particles of varying cross-sectionalshape. For example, when metal particles 27 are formed from copperspheres (FIG. 5) or oblate spheroids (FIG. 6) whose melting point isabout 1083° C., the overall wick brazing temperature for heat pipe 2will be about 1000° C. By varying the percentage brazing compound 30within the mix of metal particles 27 or, by using a more “sluggish”alloy for brazing compound 30, a wide range of heat-conductioncharacteristics may be provided between metal particles 27 and fillets33.

For example, in a copper/water heat pipe, any ratio of copper/gold brazecould be used, although brazes with more gold are more expensive. Asatisfactory combination for brazing compound 30 has been found to beabout six percent (6)% by weight of a finely divided (−325 mesh),65%/35% copper/gold brazing compound, that has been well mixed with thecopper powder (metal particles 27). More or less braze is also possible,although too little braze reduces the thermal conductivity of brazedwick 25, while too much braze will start to fill the wick pores withsolidified braze metal. One optimal range has been found to be betweenabout 2% and about 10% braze compound, depending upon the braze recipeused. When employing copper powder as metal particles 27, a preferredshape of particle is spherical or spheroidal. Metal particles 27 shouldoften be coarser than about 200 mesh, but finer than about 20 mesh.Finer wick powder particles often require use of a finer braze powderparticle. The braze powder of brazing compound 30 should often beseveral times smaller in size than metal particles 27 so as to create auniformly brazed wick 25 with uniform properties.

Other brazes can also be used for brazing copper wicks, includingnickelnickel-based Nicrobrazes, silver/copper brazes, tin/silver,lead/tin, and even polymers. The invention is also not limited tocopper/water heat pipes. For example, aluminum and magnesium porousbrazed wicks can be produced by using a braze that is analuminum/magnesium intermetallic alloy.

Brazing compound 30 should often be well distributed over each metalparticle surface. This distribution of brazing compound 30 may beaccomplished by mixing brazing compound 30 with an organic liquidbinder, e.g., ethyl cellulose, that creates an adhesive quality on thesurface of each metal particle 27 (i.e., the surface of each sphere orspheroid of metal) for brazing compound 30 to adhere to. In oneembodiment of the invention, one and two tenths grams by weight ofcopper powder (metal particles 27) is mixed with two drops from an eyedropper of an organic liquid binder, e.g., ISOBUTYL METHACRYLATE LACQUERto create an adhesive quality on the surface of each metal particle 27(i.e., the surface of each sphere or spheroid of metal) for brazecompound 30 to adhere to. A finely divided (e.g., −325 mesh) of brazecompound 30 is mixed into the liquid binder coated copper powderparticles 27 and allowed to thoroughly air dry. About 0.072 grams, about6% by weight of copper/gold in a ratio of 65%/35% copper/gold brazingcompound, has been found to provide adequate results. The foregoingmixture of metal particles 27 and brazing compound 30 are applied to theinternal surfaces of heat pipe 2, for example inner surface 18 of bottomwall 12, and heated evenly so that brazing compound 30 is melted byheating metal particles 27. Molten brazing compound 30 that is drawn bycapillary action, forms fillets 33 as it solidifies within the mixtureof metal particles 27. For example, vacuum brazing or hydrogen brazingat about 1020° C. for between two and eight minutes, and preferablyabout five minutes, has been found to provide adequate fillet formationwithin a brazed wick. A vacuum of at least 10⁻⁵ torr or lower has beenfound to be sufficient, and if hydrogen furnaces are to be used, thehydrogen furnace should use wet hydrogen. In one embodiment, theassembly is vacuum fired at 1020° C. for 5 minutes, in a vacuum of is5×10⁻⁵ torr or lower.

Referring to FIGS. 7, 8, 14, and 16–17, grooved brazed wick structure 38may also be advantageously formed from metal particles 27 combined withbrazing compound 30. More particularly, a mandrel 40 (FIG. 18) is usedto create grooved wick structure 38 that comprises a plurality ofparallel lands 45 that are spaced apart by parallel grooves 47. Lands 45of mandrel 40 form grooves 50 of finished brazed grooved wick structure38, and grooves 47 of mandrel 40 form lands 52 finished brazed groovedwick structure 38. Each land 52 is formed as an inverted, substantially“V”-shaped or pyramidal protrusion having sloped side walls 54 a, 54 b,and is spaced-apart from adjacent lands. Grooves 50 separate lands 52and are arranged in substantially parallel, longitudinally (ortransversely) oriented rows that extend at least through evaporatorsection 5. The terminal portions of grooves 50, adjacent to, e.g., aperipheral edge wall 20, may be unbounded by further porous structures.In one embodiment, a relatively thin layer of brazed metal particles isdeposited upon inner surface 18 of bottom wall 12 so as to form agroove-wick 55 at the bottom of each groove 50 and between spaced-apartlands 52. For example, brazed copper powder particles 27 are depositedbetween lands 52 such that groove-wick 55 comprises an average thicknessof about one to six average copper particle diameters (approximately0.005 millimeters to 0.5 millimeters, preferably, in the range fromabout 0.05 millimeters to about 0.25 millimeters) when deposited oversubstantially all of inner surface 18 of bottom wall 12, and betweensloped side walls 54 a, 54 b of lands 52. Advantageously, metalparticles 27 in groove-wick 55 are thermally and mechanically engagedwith one another by a plurality of fillets 33 (FIG. 17). When forminggrooved brazed wick structure 38, inner surface 18 of bottom wall 12(often a copper surface) is lightly coated with organic binder ISOBUTYLMETHACRYLATE LACQUER and the surface is “sprinkle coated” with brazecompound copper/gold in a ratio of 65%/35%, with the excess shaken off.Between 1.250 and 1.300 grams (often about 1.272 grams) of braze coatedcopper powder 27 is then placed on the braze coated copper surface andmandrel 40 is placed on top to form a grooved brazed wick structure 38.

Significantly groove-wick 55 is formed so as to be thin enough that theconduction delta-T is small enough to prevent boiling from initiating atthe interface between inner surface 18 of bottom wall 12 and the brazedpowder forming the wick. The formation of fillets 33 further enhancesthe thermal conductance of groove-wick 55. Groove-wick 55 is anextremely thin wick structure that is fed liquid by spaced lands 52which provide the required cross-sectional area to maintain effectiveworking fluid flow. In cross-section, groove-wick 55 comprises anoptimum design when it comprises the largest possible (limited bycapillary limitations) flat area between lands 52. This area should havea thickness of, e.g., only one to six copper powder particles. Thethinner groove-wick 55 is, the better performance within realisticfabrication constraints, as long as the surface area of inner surface 18has at least one layer of copper particles that are thermally andmechanically joined together by a plurality of fillets 33. This thinwick area takes advantage of the enhanced evaporative surface area ofthe groove-wick layer, by limiting the thickness of groove-wick 55 to nomore than a few powder particles while at the same time having asignificantly increased thermal conductance due to the presence offillets 33 joining metal particle 27. This structure has been found tocircumvent the thermal conduction limitations associated with the priorart.

It is to be understood that the present invention is by no means limitedonly to the particular constructions herein disclosed and shown in thedrawings, but also comprises any modifications or equivalents within thescope of the claims.

1. A heat pipe comprising: a sealed and partially evacuated enclosurehaving an internal surface; a grooved brazed wick disposed upon saidinternal surface comprising a plurality of individual particles whichtogether yield an average particle diameter and a brazing compoundcomprising about sixty-five percent weight copper and thirty-fivepercent weight gold such that said fillets of said brazing compound areformed between adjacent ones of said plurality of particles so as tocreate a network of capillary passageways between said particles, andfurther including at least two lands that are in fluid communicationwith one another through a particle layer disposed between said at leasttwo lands wherein said particle layer comprises at least one dimensionthat is no more than about six average particle diameters wherein saidparticles in said particle layer are thermally engaged with one anotherby a plurality of said fillets; and a working fluid disposed within saidenclosure.
 2. A heat pipe according to claim 1 wherein said plurality ofindividual particles are selected from the group consisting of carbon,tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminumoxide, and beryllium oxide.
 3. A heat pipe according to claim 1 whereinsaid plurality of individual particles comprise a shape selected fromthe group consisting of spherical, oblate spheroid, prolate spheroid,polygonal, and filament.
 4. A heat pipe according to claim 1 whereinsaid plurality of individual particles comprise at least one of copperspheres and oblate copper spheroids having a melting point of about1083° C.
 5. A heat pipe according to claim 1 wherein said brazingcompound is present in the range from about two percent to about tenpercent by weight.
 6. A heat pipe according to claim 1 wherein saidplurality of individual particles comprise copper powder comprisingparticles sized in a range from about twenty mesh to about two-hundredmesh.
 7. A heat pipe comprising: a sealed and partially evacuatedenclosure having an internal surface; a grooved brazed wick disposedupon said internal surface comprising a plurality of individualparticles which together yield an average particle diameter and abrazing compound comprising about sixty-five percent weight copper andthirty-five percent weight gold and further wherein said brazingcompound comprises six percent by weight of a finely divided copper/goldsuch that fillets of said brazing compound are formed between adjacentones of said plurality of individual particles so as to create a networkof capillary passageways between said individual particles, and furtherincluding at least two lands that are in fluid communication with oneanother through a particle layer disposed between said at least twolands wherein said particle layer comprises at least one dimension thatis no more than about six average particle diameters wherein saidparticles in said particle layer are thermally engaged with one anotherby a plurality of said fillets; and a working fluid disposed within saidenclosure.
 8. A heat pipe comprising: a sealed and partially evacuatedtubular enclosure having an internal surface covered by a brazed wickcomprising a plurality of particles joined together by a brazingcompound comprising about sixty-five percent weight copper andthirty-five percent weight gold such that fillets of said brazingcompound are formed between adjacent ones of said plurality of particlesso as to form a network of capillary passageways between said particleand sealed at a first end; a base sealingly fixed to a second end ofsaid enclosure so as to form an internal surface within said enclosure;a working fluid disposed within said enclosure; at least one finprojecting radially outwardly from an outer surface of said tubularenclosure; and a grooved brazed wick disposed upon said internal surfacecomprising a plurality of individual particles which together yield anaverage particle diameter and said brazing compound such that fillets ofsaid brazing compound are formed between adjacent ones of said pluralityof particles, and further including at least two lands that are in fluidcommunication with one another through a particle layer disposed betweensaid at least two lands wherein said particle layer comprises at leastone dimension that is no more than about six average particle diameterswherein said particles in said particle layer are thermally engaged withone another by a plurality of said fillets.